How to control costs in lead-free wave soldering

Many manufacturers of electronic products are actively transitioning from lead-based soldering to lead-free soldering. Now, through a lot of practical experience, it is shown that it is necessary to improveThe quality of lead-free Wave soldering should be considered from many aspects such as equipment, materials and processes. All this must be considered is how to reduce costs.

In the tunnel-type nitrogen-filled environment, the incidence of tin dross has dropped by about 80%, and the annual savings can reach as much as 300,000-1.6 million yuan. The whole process of nitrogen filling technology can improve the welding quality. The whole process of nitrogen filling technology not only reduces the operating cost, but also greatly improves the welding quality.

Because the surface tension of liquid solder in lead-free Wave Soldering is larger than that of tin-lead solder, the fluidity is poor, and the wetting ability is low. Therefore, in the wave soldering of through-hole components, the metallized holes of multi-layer printed circuit boards are lead-free. The filling and climbing ability of the solder is very poor, which directly affects the strength and reliability of the solder joint. Lead-free Reflow Soldering

Now the price of nitrogen is generally more expensive. The price of buying tin is saved, but it is completely wasted when buying nitrogen. In response to this problem, there is a tin-saving lead-free wave soldering that solves the above problems of users, which is based on the structure of the tin furnace.

Most of the oxidation of wave soldering tin is because when the tin wave is rolling, the tin in the tin furnace is completely in contact with the oxygen in the air, and then tin dross occurs continuously. In particular, the current lead-free tin produces more dross according to their own characteristics.

When other liquid tin is sprayed by the tin pump and falls into the tin furnace, the semi-cold tin in the air is thrown into the hot liquid tin and washed to the bottom of the liquid tin, forming many tin blocks in a semi-oxidized state. Also known as tofu slag tin. Some wave soldering can waste half of the profits earned by electronic manufacturers in one day.

The wave soldering furnace has two solutions to the above problems:

1. The nozzle of the tin furnace we are planning now can adjust the width of the tin spray according to the width of the circuit board, and then reduces the contact probability of liquid tin and air, which reduces the oxygen content of tin, and then reduces the formation of tin slag. Lead-free tin furnace

2. We designed a baffle before the sprayed liquid tin fell into the tin bath, so that the tin fell to the baffle and then fell into the tin bath, which also prevented the appearance of tofu slag tin.