Wave soldering even tin causes and treatment methods

Wave soldering tin is an electronic product plug-in production of Wave Soldering through common problems, mainly because of the cause of wave soldering tin many reasons, if you want to adjust the wave soldering to reduce the tin, you must find out the reason for the wave soldering tin. Magee Automation below to share the reasons and processing ideas.

Reasons for wave soldering:

1, the flux preheating temperature is too high or too low, generally at 100 ~ 110 degrees, the preheating is too low, the flux activity is not high. The preheating is too high, the flux of the tin steel is now gone, and it is easy to connect the tin;

2, there is no flux or the flux is not good or uneven, the surface tension of the tin in the molten state is not released, resulting in easy tin;

3, check the temperature of the tin furnace, control at about 265 degrees, zui good use a thermometer to measure the temperature of the peak when the peak is up, because the temperature sensor of the device may be at the bottom of the furnace or other locations. If the preheating temperature is not good, the component will not be able to reach the temperature, and the welding process will cause the tin to drag poor due to the large heat absorption of the component, and the formation of continuous tin; It may also be that the temperature of the tin furnace is low, or the welding speed is too fast;

4, regularly check to do a tin composition analysis, it is possible that the copper or other metal content exceeds the standard, resulting in a decline in the fluidity of tin, easy to cause tin;

5, check the orbital angle of wave soldering, 7 degrees zui is good, too easy to hang tin;

6, IC and row plug design is poor, put together, the distance between the four sides of the IC tight foot < 0.4mm, there is no inclined angle into the board;

7. PCB is heated and deformed in the middle of the sinking, resulting in continuous tin; Lead-free Double Wave Soldering

8, tin steel is too high, the original eat too much tin, too thick, will be connected;

9. There is no design solder dam between the circuit board pads, which is connected after printing solder paste; Perhaps the circuit board itself is designed with a solder dam/bridge, but it may be lost in part when making the finished product, so it is easy to connect tin.

Wave soldering and tin processing method:

1. The flux is not good or it may not be uniform, increase the flow;

2. Liantin speed acceleration point, orbital angle magnification point;

3. Do not use 1 wave, use 2 waves of single wave, eat the height of tin does not have to be 1/2, you can just touch the bottom of the board is enough. If you have a pallet, then the tin surface is hollowed out on the high surface of the pallet;

4. Whether the board is deformed; Six-temperature zone Reflow Soldering

5. If the 2-wave singles are not good, use 1 wave to punch, 2 waves to hit the low touch pin can be, so that you can repair the shape of the solder joint, come out just fine.