What is reflow soldering and what are the functions of reflow soldering

2022-09-13

Reflow Soldering is the most important process technology in T. The quality of reflow soldering is the key to the reliability of A. It directly affects the performance reliability and economic benefits of electronic equipment, and the quality of soldering depends on the soldering method, soldering material and soldering process used. Technology and welding equipment. So, next, Xiaojin will tell you what is reflow soldering and what are the functions of reflow soldering?

High quality hot air reflow soldering

What is reflow soldering

Reflow soldering is one of the three main processes in the T-mount process. Reflow soldering is mainly used to solder circuit boards with components mounted. The solder paste is melted by heating so that the patch components and the circuit board pads are fused and welded together, and then the solder paste is cooled by reflow soldering to cool the components and The pads are cured together. However, most people understand that reflow soldering machine, that is, reflow soldering is a kind of machine completed by welding components on PCB board. It is a very wide application at present. Basically, most electronics factories will use it. To understand reflow soldering, you must first understand the **t process. Of course, it is soldering in popular terms, but reflow soldering provides a reasonable temperature during the soldering process, that is, the furnace temperature curve.

The role of reflow soldering

The function of reflow soldering is to send the circuit board with the SMD components installed into the T reflow soldering chamber, and after high temperature, the solder paste used for soldering the SMD components is melted through a process of high temperature hot air to form a reflow temperature change, so that the SMD components and the The pads on the board are bonded and then cooled together.

Features of Reflow Soldering Technology

1. The thermal shock of the components is small, but sometimes it will give the device a large thermal stress.

2. Only apply solder paste in the required parts, which can control the amount of solder paste applied and avoid defects such as bridging.

3. The surface tension of the molten solder can correct the slight deviation of the placement position of the components.

4. Local heating heat sources can be used, so that different welding processes can be used for welding on the same substrate.

5. Impurities are generally not mixed into the solder. When using solder paste, the composition of the solder can be properly maintained.

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