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2021 / 09 / 26
In the soldering process of electronic products, reflow soldering and wave soldering are commonly used. With the continuous development of electronic product skills, later on the market there are two types of low-temperature solder paste and high-temperature solder paste in the reflow soldering process. So what is the difference between these two solder pastes? At present, the common solder paste refers to high-temperature solder paste. Low-temperature solder paste is developed to adapt to certain electronic components that cannot adapt to the high-temperature environment. The difference between them will be explained in detail below. Reflow soldering process 1. Literally speaking, "high temperature" and "low temperature" refer to the difference between the melting points of these two types of solder paste. Generally speaking, the conventional melting point of reflow soldering is above 217°C; while the conventional low-temperature solder paste has a melting point of 138°C. 2. The purpose is different. High-temperature solder paste is suitable for high-temperature soldering components and PCBs; while low-temperature solder paste is suitable for components or PCBs that cannot withstand high-temperature soldering, such as radiator module soldering, LED soldering, high-frequency soldering, and so on. 3. The welding effect is different. Look at reflow soldering. High-temperature solder paste has good solderability, firmness, and few solder joints and bright; relatively poor solderability, solder joints are more brittle, easy to detach, and solder joints have a dull luster.
What are the ways to check and adjust the temperature of the reflow oven?
2021 / 09 / 26
Different temperature zones in the four temperature zones of the reflow oven (heating zone, preheating constant temperature zone, reflow soldering zone, and cooling zone) have special effects. First, if the temperature rise in the heating zone is too large, the introduction slope is too high It may also cause mechanical damages such as ceramic capacitor microcracks, PCB board deformation and warping, and BGA internal damage due to thermal stress. Therefore, for special products, if smt products have very strict requirements on the temperature control of the reflow soldering furnace, they will focus on the control in the furnace temperature test and adjustment link. Reflow oven 1. Reflow oven temperature test. Solder the temperature sensor to the corresponding test points of the PCB in accordance with the requirements of the furnace temperature tester operating specifications and operating procedures; according to the furnace temperature tester operating specifications and operating procedures, put the furnace temperature tester and PCB on the track of the welding equipment. Run the welding equipment and collect data on the temperature curve of the welding equipment. The data collector of the furnace temperature tester is shown in the figure below. 2. Import the reflow soldering temperature curve data obtained by the furnace temperature tester data collector into the furnace temperature tester, and use the analysis software to analyze the actual temperature curve. If the actual welding temperature curve does not reach the preset result, the temperature curve is corrected again. And lead the revised welding procedure to the welding equipment again.
What are the precautions for wave soldering maintenance?
2021 / 09 / 26
Operators of wave soldering must maintain and maintain the machine from time to time to ensure the safety of personnel and equipment, normal operation and product quality, reduce equipment failures, and avoid accidents. Therefore, the operator must do the following: Wave soldering 1. The equipment must always keep the motor shell clean with hot air, cooling, transmission, wave crest, etc. to facilitate heat dissipation; 2. Regularly check the connection of the heater in the tin furnace and preheater. If looseness, poor contact, insulation aging, etc. are found, they should be tightened, cleaned, and replaced; the equipment should be regularly checked for good grounding; 3. In the event of a situation, the opening and closing of the main power switch should be carried out after the large current load such as the tin furnace, preheating and wave crest is stopped; 4. When the wave motor is not rotating, manual speed adjustment is prohibited to prevent damage to the speed adjustment mechanism; during the process of melting solder and adding high-temperature liquid solder to the tin furnace, you need to wear necessary protective equipment to prevent burns; 5. All transmission parts should be kept well lubricated. Except for the angle adjustment mechanism that can be used with ordinary grease, the rest should be lubricated with high temperature grease; 6. Regularly check the lubrication and operation of the wave peak motor to ensure its normal operation; the tin furnace nozzle is cleaned once a week to avoid blocking the nozzle due to debris and affecting the smoothn
What is the difference between reflow soldering and wave soldering?
2021 / 09 / 26
Soldering technology occupies an extremely important position in the assembly of electronic products. Generally, soldering is divided into two categories: reflow soldering and wave soldering. The following editor will tell you the main difference between reflow soldering and wave soldering. Reflow soldering, also known as reflow soldering, refers to the mechanical connection between the solder ends or pins of surface mount components and the printed board pads by remelting the paste-like solder pre-allocated on the printed board pads. Soldering with electrical connections, so as to achieve a certain reliable circuit function; wave soldering is to spray the molten solder through an electric pump or an electromagnetic pump into the solder wave peaks required by the design, so that the electronic components are pre-installed The printed board of the device realizes the soft soldering of the mechanical and electrical connection between the solder end of the component or the pin and the printed board pad through the solder wave. As these two welding methods are high-end welding technologies in the industry, what is the difference between them? Lead-free wave soldering Reflow soldering is a group or point-by-point soldering process in which an appropriate amount and appropriate form of solder is applied to the soldering part of the PCB in advance, then surface mount components are placed, and the solder is reflowed to meet the soldering requirements by an external heat source. Compared with wave soldering, reflow soldering has the following characteristics: One, reflow soldering does not require the components to be directly immersed in molten solder like wave soldering, so the thermal shock to the co
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